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AMAOE BGA Stencil For Reballing Platform for iPhone X- 11 12 PCB SUIT Magnetic Reballing Kit Platform Heat Template With 0.12MM

Home » Tools » Welding & Soldering Supplies » AMAOE BGA Stencil For Reballing Platform for iPhone X- 11 12 PCB SUIT Magnetic Reballing Kit Platform Heat Template With 0.12MM
Enlarge AMAOE BGA Stencil For Reballing Platform for iPhone X- 11 12  PCB SUIT Magnetic Reballing Kit Platform Heat Template With 0.12MM
AMAOE BGA Stencil For Reballing Platform for iPhone X- 11 12  PCB SUIT Magnetic Reballing Kit Platform Heat Template With 0.12MM enlarge
AMAOE BGA Stencil For Reballing Platform for iPhone X- 11 12  PCB SUIT Magnetic Reballing Kit Platform Heat Template With 0.12MM enlarge
AMAOE BGA Stencil For Reballing Platform for iPhone X- 11 12  PCB SUIT Magnetic Reballing Kit Platform Heat Template With 0.12MM enlarge
AMAOE BGA Stencil For Reballing Platform for iPhone X- 11 12  PCB SUIT Magnetic Reballing Kit Platform Heat Template With 0.12MM enlarge
AMAOE BGA Stencil For Reballing Platform for iPhone X- 11 12  PCB SUIT Magnetic Reballing Kit Platform Heat Template With 0.12MM enlarge
AMAOE BGA Stencil For Reballing Platform for iPhone X- 11 12  PCB SUIT Magnetic Reballing Kit Platform Heat Template With 0.12MM enlarge
Price from: 107.25 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

AMAOE BGA Stencil For Reballing Platform for iPhone X- 11 12 PCB SUIT Magnetic Reballing Kit Platform Heat Template With 0.12MM
Introducing the AMAOE BGA Stencil For Reballing Platform, the ultimate solution for reballing the PCBs of iPhone X, 11, and 12 models. This magnetic reballing kit platform is designed to provide precise and efficient reballing for your iPhone's PCBs. With its innovative heat template and 0.12MM stencil, you can ensure accurate and reliable reballing every time.

The AMAOE BGA Stencil For Reballing Platform is specifically crafted for iPhone X, 11, and 12 models, ensuring compatibility and optimal performance. Whether you are a professional technician or a DIY enthusiast, this reballing kit platform is perfect for you. It simplifies the process of reballing by providing a magnetic platform that securely holds the PCB in place, allowing you to work with ease and precision.

Equipped with a 0.12MM stencil, this reballing platform guarantees accuracy and efficiency. The stencil is designed to ensure proper alignment and distribution of solder balls, minimizing the risk of errors during the reballing process. Additionally, the heat template included in this kit provides even heat distribution, ensuring consistent results and preventing damage to the PCB.

Upgrade your reballing process with the AMAOE BGA Stencil For Reballing Platform. Its magnetic platform, 0.12MM stencil, and heat template make it the ideal choice for reballing the PCBs of iPhone X, 11, and 12 models

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